条件に該当する製品2376件
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MI-16AI4WR( 4-Channel Mutually-Isolated Wide-Range Analog Input Board with Isolated Conditioning and A/D conversion,and Sampling Rates to 200 KSPS per Channel)
GneralStandardsCorporation A/D PCI 試験 環境4 Mutually Isolated High-Level or Low-Level Analog Input Channels 16-Bit, 200KSPS ADC and Active Lowpass Filter per Channel Isolation-Side Signal Conditioning and A/D Conversion (Eliminates the traditional errors caused by passing analog signals through the isolation barrier) Exceptional 0.01 Percent Accuracy Across The Isolation Barrier Simultaneous Sampling of All Channels 240 VAC Channel-to-Channel and Channel-to-Bus Isolation Active Lowpass Filter Cutoff Frequency Selectable as 2 kHz or 75 kHz Post-Conversion Digital Filter Cutoff Frequency Adjustable Down to 1.0 Hz 32 K-Sample FIFO Buffer Selectable Input Ranges: �10V, �5V, �2.5V, �1.0V, �100mV, �50mV, �25mV 66 MHz PCI Support
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MCP500
Abaco Systems （旧GE Intelligent Platforms） GPGPU VPX 防衛・Tilera® TILEPro64™ 700MHz processor (64 general purpose processor cores for compute-intensive applications) ・2x Four-lane PCIe interface (Gen1 support) ・Four banks of 512MBytes DDR2 800 SDRAM ・2x 10Gbps XAUI connections for interfacing to external 10GbE 10GBASECX4 devices ・RS-232 UART ・User-selectable boot options, including host boot via the PCIe on board boot ROM* ・C/C++ Programming model ・Supports Linux, SMP Linux and VxWorks® ・Standard tool chain based on Eclipse and GNU ・Host Operating System support for Linux ・VPX REDI convection and conduction cooled variants
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mCOM10-L1500 Rugged COM Express Module – Type 10 ‘Mini’ module
GE intelligent platforms AMD COM Express 防衛Form Factor : COM Express mini, Type 10 Processor : AMD Embedded G-Series SOC Maximum Memory : Up to 8 GB DDR3 SDRAM Ethernet : Gigabit Ethernet Conformal Coating : Option Operating System (OS) Support : Linux, VxWorks, Windows Memory : Up to 8GB DDR3 Operating Temp : 0°C to +65°C
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mCOM10-K1 Mini COM Express
GE intelligent platforms GPGPU COM Express 防衛• Small form factor - Size (84x55 mm) makes the mCOM10-K1 ideal for applications where compact size is critical • Rugged design with soldered components - Reliable computing capabilities for applications needing higher immunity to shock and vibration • NVIDIA Tegra K1 SOC platform - Delivers a total of 327 GFLOPS of compute performance while drawing less than 10W power - General purpose computing on Graphics Processing Units (GPGPU) for data-intensive applications • Flexible options - Additional shock and vibration protection - Extended operating temperature range for environments with temperature extremes
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MBX1553 Multiplex Bus Switch
Curtiss-Wright 1553/ARINC BOX 防衛・Save time by wiring once. Connect all LRU devices and Busses under test just one time. Then make connection changes using the switch. Eliminate bus rewiring when changing avionics simulations or test scenarios. ・Reduce errors with automated tests. Connect with the RS232 and remotely change LRU-to-Bus connections. Write scripts in PERL, TCL, or other scripting languages using the simple, but powerful CLI. Running the same scripts reduces human errors in wiring and configuration. ・Save money by sharing expensive resources. Move limited BC, RT, BM, analyzers, recorders, or other devices from bus to bus.
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MB1-5576
Abaco Systems （旧GE Intelligent Platforms） リフレクティブメモリ その他 ロボット 半導体製造機 生産中止品(EOL)・Error detection ・Data transferred at 6.2 Mbyte/s without redundant transfer ・Any node on the network can generate an interrupt in any other node with a single command ・Data transferred at 3.2 Mbyte/s with redundant transfer ・Data written to memory in one node is also written to memory in all nodes on the network ・High-speed, easy-to-use fiber-optic network (170 Mbaud serially)
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MaxCore™ Platform -Versatile and Dense Compute & Media Platform
SMART Embedded Computing(旧Artesyn Embedded Technologies) クラウド製品 BOX 通信・ キャリア・Dimensions: 3U by 508mm for 19” racks, option for rail mounting ・Cable-less internal architecture for SharpServer microserver cards ・Optimal platform cooling with internal connectors for optionally supplying additional power for PCI Express cards requiring more than 75W ・15 PCI Express slots ・4x PCIe Gen3 x16 (each x16 link can be split into four x4 links) ・11x PCIe Gen3 x8 (each x8 link can be split into two x4 links) ・Full length PCI Express slots ・90 - 264VAC and -48VDC support ・2 + 1 redundant 2200W total for all slots with a maximum of up to 150W per slot ・Non-redundant 3300W for all slots ・Hot swappable ・2x 10GBASE-T with SR-IOV support for shared usage between multiple server cards ・2x USB, dynamically connected to active and standby system host processors ・LEDs: Major/Minor/Critical alarms, SATA ・Switches/Buttons: Power, Reset, NMI ・Redundant fan blocks ・Hot swappable ・Front-to-rear cooling ・Air filter, replaceable ・4x 2.5” SATA hard-drive bays for use by system hosts ・BMC for remote platform management ・IPMI 2.0 support ・1x 1000Base-T and sideband access to two 10GBaseT ports
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MaxCore™ Hyperscale Platform – High Density Compute And Media For Dell DSS 9000 Racks
SMART Embedded Computing(旧Artesyn Embedded Technologies) クラウド製品 BOX 通信・ キャリア・High performance density in Dell DSS 9050 sub-chassis ・Redundant intelligent 100G and more network I/O per sled enables flexible, programmable packet forwarding ・Microserver and switch cards with up to 576 Intel® Xeon® processor D cores per tray ・PCI ExpressFabric built-in infrastructure ・Full SDN/NFV packet forwarding and virtualization support enables seamless scaling ・Designed for Dell DSS 9000 platforms
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KTQM87/mITX
Kontron マザーボード マザーボード 3.5インチボード 鉄道/交通Embedded Mitx Mobile Motherboard with Intel® QM87 and 4th Generation Intel® 22nm Dual and Quad CoreI7/I5/I3, Pentium & Celeron® CPUs ・Long term available Embedded mITX mobile class motherboard ・Mobile Class high performance CPU, graphics, and media performance supporting 3 independent displays pipes ・Graphics APIs DirectX 11.1, OpenGL 4.x, OpenCL 1.2 ・3x Display Port for flexible, high resolution display drive ・LVDS interface
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KTQM77/mITX
Kontron Mini-ITX/Pico-ITX マザーボード 3.5インチボード 鉄道/交通KTQM77/mITX Embedded & Longterm Available Mini ITX Board ・3rd Generation Intel® i7-,i5,-i3 2Core and 4Core CPUs & Intel® QM77 Chipset ・Long term available embedded Mini ITX-Motherboard (up to 7 years after release) ・High graphics performance incl. 2 x Display Port, LVDS & DVI ・3 independent display support ・6 x SATA (incl. 2 x SATA III), 4 x USB 3.0 & 10 x USB 2.0 ), 3 x Intel® GB LAN incl. Intel® AMT 8.0 support ・mSATA interface highspeed compact SSD storage ・ATX and single 12V power supply ・One PCIe x 16, Gen. 3.0 plus one PCIe x 1, Gen. 2.0 ・Unique multipurpose KT Feature Connector
