条件に該当する製品402件
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VME-196 NXP Power Architecture T2080 Single Board Computer
Curtiss-Wright PowerPC (FreeScale) VMEbus 防衛NXP T2080 quad-core 64-bit SoC running up to 1.8 GHz with AltiVec • Dual PMC/XMC sites • Curtiss-Wright’s U-Boot, Green Hills INTEGRITY, Lynx Software Technologies LynxOS, Yocto NXP SDK based Linux and Wind River VxWorks 6.9 and 7 BSPs • NXP Secure BOOT Applications • Commercial • Control Computers • Mission Computers • ISR applications • SWaP-C consolidation
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VME-1910 6U VME 9th Gen Intel® Xeon Single Board Computer
Curtiss-Wright Intel VMEbus 防衛Intel 9th Gen “Coffee Lake Refresh” E-2276ME Xeon processor + 6-core (12-thread) CPU at 2.8 GHz with Turbo to 4.5 GHz • Up to 32 GB DDR4 at 2,400 MT/s with ECC • Up to 256 GB high-performance NVMe onboard storage • Supports two PMC/XMC expansion mezzanines • Supports Linux® (CentOSTM and Red Hat® Enterprise Linux (RHEL)), VxWorks®, GHS Integrity®, Microsoft® Windows® and LynxOS® • Trusted Computing features + Curtiss-Wright TrustedCOTS™ Trusted Boot protections + Intel TPM 2.0 hardware RoT + Intel Boot Guard for verified/trusted boot + UEFI Secure Boot + SSD encryption • Available in air-cooled and conduction cooled versions
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VPX6-197NXP Power Architecture T2080 Single Board Computer
Curtiss-Wright PowerPC (FreeScale) OpenVPX 防衛NXP T2080 quad-core 64b SoC running up to 1.8 GHz with AltiVec • Dual mezzanine sites • Curtiss-Wright’s U-Boot and Wind River VxWorks 7 BSP (for other OS support consult factory) • NXP Secure Boot support Applications • Commercial • Control Computers • Mission Computers • ISR applications • SWaP-C consolidatio
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CHAMP-XD4 (VPX6-485)6U VPX Dual Intel® Xeon® D-2700 and Cognitive DSPProcessor Aligned with The SOSA™ Technical Standard
Curtiss-Wright Intel OpenVPX 防衛• Developed in alignment with the SOSA Technical Standard as a 6U Compute Intensive Processor Plug-in-Card • 6U VPX® conduction cooled form factor with 2LM covers • Two Intel D-2700 CPUs with 12, 16 or 20 cores each at up to 2.0 GHz • Four memory channels totaling 64 GB DDR4 @2400 MT/s per CPU node (76.8 GB/s aggregate per node) • Quad 100 Gb Ethernet ports on the VPX Data Plane with RoCE V2 RDMA support • 32-lanes PCIe Gen4 Expansion Plane • Dedicated AMD® ZU6EG to ZU15EG MPSoC FPGA with embedded quad-core A53 processor and 4 GB of SDRAM memory for enhanced security or co-processing applications
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CHAMP-XD2MHigh Memory Capacity Multi-Core HPEC Modulebased on the Intel Xeon Processor D
Curtiss-Wright Intel OpenVPX 防衛Xeon D 16-core processor (870 GFLOPS @ 1.7 GHz) • Alternative Xeon D SKUs available • 128 GB DDR4 @ 2133 MT/s (34 GBps over 2 ECC channels) • Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch • PCH integrated in Xeon D SoC • Core Function FPGA (Xilinx UltraScale) and IPMI (Microsemi SmartFusion) • Air and conduction-cooled • TrustedCOTS
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VPX3-1703NXP Layerscape LS1043A Quad A53Single Board Computer
Curtiss-Wright ARM VPX 防衛NXP LS1043A Arm A53 quad-core 64-bit SOC up to 1.6 GHz • 4 GB DDR4 memory • x4 PCIe Gen2 XMC • Curtiss-Wright’s U-Boot, VxWorks 7, and Linux BSPs • NXP Secure BOOT
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VPX3-1708/V3-1708DO-254 Safety-Certifiable LX2160ASingle Board Computer
Curtiss-Wright ARM VPX 防衛NXP LX2160A Arm Cortex A72 16-core 64-bit Processor • Dual 64-bit memory controllers with ECC providing up to 32 GB DDR4 SDRAM • 80 GB Flash SSD (SLC) • 4-lane PCIe® XMC expansion site • Rugged conduction cooled with 2LM covers
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CHAMP™-XD1High Performance Multi-Core HPEC Module based onthe Intel Xeon Processor D
Curtiss-Wright Intel VPX 防衛• Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz) • Extended operating temperature Intel eTEMP SKUs • PCH integrated in Xeon D SoC • Native dual KR 10 GigE ports • 16 to 32 GB DDR4 @ 2133 mega transfers per second (34 GB/s aggregate) • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • PCIe Gen3 on 3U OpenVPX data plane with switch • Core Function FPGA and IPMI • Conduction and air-cooled • TrustedCOTS
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CHAMP™-XD2High Performance Multi-Core HPEC Module based onthe Intel Xeon Processor D
Curtiss-Wright Intel OpenVPX 防衛Key Features • Dual processor Xeon D 8-core (820 GFLOPS @ 1.6 GHz total) or 12-core (1152 GFLOPS @ 1.5 GHz total) • Extended operating temperature Intel eTEMP SKUs • PCH integrated in Xeon D SoC • Four ports of 40G/10G Ethernet or DDR/ QDR/FDR10 InfiniBand on OpenVPX data plane • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane • 16 to 32 GB DDR4 @ 2133 mega transfers per second per Xeon D socket (68 GB/s aggregate) • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch • Core Function FPGA and IPMI • Air and conduction-cooled + Contact Curtiss-Wright for Air-Flow Through (AFT) or Liquid-Flow Through (LFT) options • TrustedCOTS
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CHAMP-XD33U VPX Intel Ice Lake Xeon D-1700 HPEC and Cognitive DSPModule Aligned with The SOSA™ Technical Standard
Curtiss-Wright AMD OpenVPX 防衛The CHAMP-XD3 combines the high core count and floating-point perfor mance of the Intel “Ice Lake D” processor with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form-factor. Providing an extended temperature Xeon D-1700 LCC processor with 10 dual-threaded cores, the CHAMP-XD3 brings Intel’s AVX512 floating-point capability to the rugged embedded marketplace. Processor performance is enhanced with 48 GB of high capacity DDR4-2400 in three independent memory channels, providing over 50% more memory bandwidth than prior generation modules ensuring memory accesses are not a bottleneck. The Ice Lake D processor provides new Intel Deep Learning Boost with op timized commands for AI applications which are ideal for cognitive EW and other smart sensor processing applications. Aligned with the SOSA Technical Standard, the CHAMP-XD3 supports a 40 GbE Data Plane, dual 10 GbE interfaces, and up to 16 lanes of Gen3 PCI Express® (PCIe) on the Expansion Plane, with a pinout aligned to the Payload PIC profile of the SOSA standard. The CHAMP-XD3 includes a AMD Zynq™ UltraScale+™ MPSoC field pro grammable gate array (FPGA) with additional security features, embedded quad-core Arm® A53 processor and dual-core R5 processor used for en hanced TrustedCOTS™ security, as a co-processor or for general purpose I/O. System monitoring and health is supported with IPMI (VITA 46.11) with HOST extensions as required for SOSA conformance.
