条件に該当する製品200件
-
VT880
VadaTech 筐体 µTCA 通信・ キャリア・μTCA System Platform 19� x 2U x 14.2� deep ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・High-speed mTCA connectors (12.5 GHz) ・Telco Alarm ・JTAG Switch Module (JSM) slot with front port access ・CLK1, CLK2 and CLK3 ・Removable Air Filter, Power Module and Fan Tray ・No active components on the backplane ・ESD-Jack ・RoHS compliant ・Up to twelve AMCs: four full-size and eight mid-size ・Dual star topology ・Radial I2C bus to each AMC ・High-speed routing on 26 layers
-
VT892
VadaTech 筐体 µTCA ロボット 半導体製造機・μTCA System Platform 19� x 7U x 10.5� deep (with handles 12� deep) ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・High-speed routing on 26 layers ・High-speed mTCA connectors (12.5 GHz) ・Redundant FRU information devices ・Redundant Carrier Locator ・1000W AC Power supply option ・Telco Alarm ・CLK1, CLK2 and CLK3 ・No active components on the backplane ・JTAG Switch Module (JSM) Slot ・ESD-Jack at the top front ・Cooling from bottom to top ・RoHS compliant ・Up to twelve AMCs: 12 full-size double-width ・Dual star topology ・Radial I2C bus to each AMC
-
VT891
VadaTech 筐体 µTCA 物理 天体・μTCA System Platform 19� x 7U x 10.5� deep (with handles 12� deep) ・μTCA System Platform 19� x 7U x 10.5� deep (with handles 12� deep) ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・JTAG Switch Module (JSM) Slot ・Redundant Carrier Locator ・ESD-Jack at the top front ・1000W AC Power supply option ・Up to twelve AMCs: 12 full-size double-width ・Telco Alarm ・Dual star topology ・CLK1, CLK2 and CLK3 ・Radial I2C bus to each AMC ・No active components on the backplane ・High-speed routing on 26 layers ・JTAG Switch Module (JSM) Slot ・High-speed mTCA connectors (12.5 GHz) ・ESD-Jack at the top front ・Redundant FRU information devices ・Up to twelve AMCs: 12 full-size double-width ・Redundant Carrier Locator ・Dual star topology ・1000W AC Power supply option ・Radial I2C bus to each AMC ・Telco Alarm ・High-speed routing on 26 layers ・CLK1, CLK2 and CLK3 ・High-speed mTCA connectors (12.5 GHz) ・No active components on the backplane ・Redundant FRU information devices
-
VT894
VadaTech 筐体 µTCA 物理 天体・μTCA System Platform 19� x 7U x 10.5� deep (with handles 12� deep) ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・Up to twelve AMCs: 12 full-size double-width ・Dual star topology ・Radial I2C bus to each AMC ・High-speed routing on 26 layers ・High-speed mTCA connectors (12.5 GHz) ・Redundant FRU information devices ・Redundant Carrier Locator ・1000W AC Power supply option
-
VT893
VadaTech 筐体 µTCA ロボット 半導体製造機・μTCA System Platform 19� x 7U x 10.5� deep (with handles 12� deep) ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules ・Redundant Carrier Locator ・1000W AC Power supply option ・Telco Alarm ・CLK1, CLK2 and CLK3 ・No active components on the backplane ・JTAG Switch Module (JSM) Slot ・ESD-Jack at the top front ・Up to twelve AMCs: 11 full-size double-width ・Dual star topology ・Radial I2C bus to each AMC ・High-speed routing on 26 layers ・High-speed mTCA connectors (12.5 GHz) ・Redundant FRU information devices
-
VT899
VadaTech 筐体 µTCA 試験 環境・μTCA System Platform 5� x 7U x 9� deep (with handles 10� deep) ・Redundant Cooling Units ・Redundant FRU information devices ・Redundant Carrier Locator ・Telco Alarm ・CLK1, CLK2 and CLK3 ・No active components on the backplane ・JTAG Switch Module (JSM) Slot ・ESD-Jack at the top front ・RoHS compliant ・Up to six AMCs: 6 full-size single-width or 3 full-size double width ・Radial I2C bus to each AMC ・High-speed routing on 26 layers ・High-speed mTCA connectors (12.5 GHz)
-
VT830
VadaTech 筐体 AdvancedTCA 通信・ キャリア・Unprecedented performance density ・Densest Switching Shelf Manager (SSM) ・40G or 10G ATCA 6-slot backplane ・Full status LEDs, 8x 10GbE SFP+ ・2 GbE ports, 2 RS-232 de-bug ports ・Telco alarm ・Superior push-pull cooling to 375W ・Conforms to PICMG 3.0 spec Rev.3.0
-
VT840
VadaTech 筐体 µTCA 通信・ キャリア・Dual swappable power/fan tray with failover (option for non-redundant independent segments) ・Power Modules in rear of chassis to save space ・High performance combination of Quad SAS, Quad SPF+ for 10 GbE, and Layer 2 GbE
-
VT835
VadaTech 筐体 AdvancedTCA 試験 環境・19” rack mount 3U ATCA Hybrid AMC Chassis ・Holds 1 ATCA slot and 8 mid-size AMC slots ・40G or 10G fabric across the backplane ・8x PCIe Gen 3, 4x Gen 2 SRIO, or Layer 2 / 3 managed 10GbE / 40GbE dual XAUI ・Redundant push / pull cooling configuration ・Integrated dual shelf managers, switch and AMC carrier ・Full redundancy for all FRUs ・Redundant AC or DC Power Modules ・2x ATCA RTM slots ・ESD Jack
-
VT816 – 1U μTCA.4 Chassis with 2 AMC Slots, PCIe Gen 3
VadaTech 筐体 µTCA 物理 天体・MicroTCA.4 low-profile chassis platform ・19” x 1U x 14.2” deep ・Compliant to μTCA.4 specifications with rear IO ・Supports up to two μTCA.4 mid-size or single full-size ・Right-to-left cooling ・Integrated MCH and Power Module ・Integrated Intel Xeon E3-1125 v2 processor, up to 2.5 GHz ・Front panel access to the SDHC socket, JTAG, and Telco Alarm ・Dual x4 PCIe lanes to each AMC ・Layer 2 managed GbE switch ・Dual SFP+, octal RJ-45, quad USB, and one DVI-I port ・Optional dual SAS/SATA disks ・Removable Air Filter, Power Module, and Fan Tray ・Single AC 400W, DC460W pluggable from rear ・RoHS compliant
