条件に該当する製品200件
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VT072
VadaTech バックプレーン AdvancedMC 試験 環境・Single slot AMC backplane ・Provides +12V and Management Power to the AMC Module ・Port 0 and 1 are routed to the GbE PHY ・Three M3 Mounting holes to mate to any frame size ・RoHS compliant
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VT872
VadaTech 筐体 µTCA 防衛・μTCA.3 System Platform 1/2 short Air Transport Rack (ATR) per ARNIC404A, with NO internal fan (12.62� deep without handle) ・Customized Front Panel Input/Output (I/O) Panel Connector layout per customer requirement (option per MIL-DTL-M38999) ・Single MCH and Power Module slot ・Up to 6 AMCs mid-height ・Radial I2C bus to each AMC ・High-speed routing on 26 layers ・High-speed mTCA connectors (12.5 GHz) ・FRU information devices with chassis locator ・CLK1, CLK2 and CLK3 ・No active components on the backplane ・Secondary mounting provision to allow the chassis to be secured to a base plate ・RoHS compliant ・Vib/Shock per MIL-STD-810E and MIL-STD-810
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VT811
VadaTech 筐体 µTCA 物理 天体・μTCA System Platform 19� x 8U x 14.9� deep (with handles 16.23� deep) ・μTCA System Platform 19� x 8U x 14.9� deep (with handles 16.23� deep) ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and quad Power Modules ・Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and quad Power Modules ・No active components on the backplane ・ESD-Jack at the top front ・JTAG Switch Module (JSM) Slot ・RoHS compliant ・ESD-Jack at the top front ・Up to twelve AMCs: 12 mid-size double-width front module with 12 mid-size double-width rear ・RoHS compliant ・Provision to route cables from the front to the back ・Up to twelve AMCs: 12 mid-size double-width front module with 12 mid-size double-width rear ・Radial I2C bus to each AMC ・Provision to route cables from the front to the back ・High-speed routing on 26 layers ・Radial I2C bus to each AMC ・High-speed μTCA connectors (12.5 GHz) ・High-speed routing on 26 layers ・Redundant FRU information devices ・High-speed μTCA connectors (12.5 GHz) ・Redundant Carrier Locator ・Redundant FRU information devices ・Dual 1000W AC Power supply option ・Redundant Carrier Locator ・Telco Alarm ・Dual 1000W AC Power supply option ・FCLKA, TCKA, TCKB, TCLKC AND TCLKD ・Telco Alarm ・No active components on the backplane ・FCLKA, TCKA, TCKB, TCLKC AND TCLKD ・JTAG Switch Module (JSM) Slot
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VT813
VadaTech 筐体 µTCA 物理 天体・μTCA.4 Chassis Platform with rear I/O ・19” x 8U x 14.9” deep (with handles 16.23” deep) ・Full redundancy with dual MicroTCA Carrier Hubs (MCH), dual cooling units and quad PSUs ・Up to twelve AMCs: 12 mid-size double-modules in front with 12 mid-size, double-module in the rear ・Provision to route cables from the front to the back ・Radial I2C bus to each AMC ・High-speed 30 layer passive backplane (40GbE ready)
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VT812
VadaTech 筐体 µTCA 物理 天体・High performance density with 8 AMCs and redundant MCHs and PMs in a 2U height ・Versatile mix of MTCA.4 slots with rear I/O and 4 single or double width AMCs ・Design utilizes proven VadaTech subcomponents and engineering
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VT841
VadaTech 筐体 µTCA 物理 天体・Six mid-height AMC slots per 1U Carrier or two double width mid-height with two mid-height AMC slots ・Cascade any number of 1U Carriers for Fabric expansion and management ・Telco Alarm and Carrier Locator ・Telcom/GPS Clock on TCLKA, TCLKB, TCLKC and TCLKD and Fabric Clock on FCLK ・Redundant Cooling Units (CU) ・Removable Power Supply, Air Filter and Fan Trays ・IPMI 2.0 compliant ・RoHS compliant ・Management can run as Shelf/MCMC (MicroTCA Carrier Management Controller) or MCMC ・AMC.1, AMC.2, AMC.3, AMC.4 compliant ・PCIe, SRIO, 10GbE available on ports 4 to 7 and 8 to 11 ・GbE Managed Layer Two (ports 0 and 1)
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VT820
VadaTech 筐体 AdvancedTCA 通信・ キャリア・14 Slot Rugged ATCA Shelf ・14 Slot Rugged ATCA Shelf ・Conforms to PICMG 3.0 specification ・Conforms to PICMG 3.0 specification ・Split power distribution (odd slots on A1/B1, even slots on A2/B2) ・Customized Rear I/O (BACC MIL- 26500 Connectors) ・Front to back cooling ・RoHS compliant ・14-slot Fabric interface with Dual Star Interconnect ・Base Interface with Dual Start interconnect ・Redundant Power supply ・Meets MIL-STD-810F for shock/vibration ・Airflow Baffle Plate Provision ・Meets MIL-STD-461E for EMI ・Bussed IPMI ・Split power distribution (odd slots on A1/B1, even slots on A2/B2) ・Passive Backplane ・Front to back cooling ・Customized Rear I/O (BACC MIL- 26500 Connectors) ・Redundant Power supply ・RoHS compliant ・Airflow Baffle Plate Provision ・14-slot Fabric interface with Dual Star Interconnect ・Bussed IPMI ・Base Interface with Dual Start interconnect ・Passive Backplane
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VT846
VadaTech 筐体 µTCA 鉄道/交通・Two full-height (or two mid-height) AMC slots ・Management can run as Shelf/MCMC (μTCA Carrier Management Controller) or MCMC ・Telco Alarm and Carrier Locator ・Cooling is front to back ・Removable Air Filter and Fan Trays ・Removable AC or DC input option ・IPMI 2.0 compliant ・RoHS compliant ・AMC.1, AMC.2, AMC.3, AMC.4 compliant ・Direct connect across the two AMC slots on ports 4-7 and 8-11 (any protocol could run such as PCIe, SRIO, 10GbE, Aurora, etc.) ・GbE managed switch ・Removable dual 2.5� SATA/SAS disk with direct connect via SATA/SAS (port 2 or 3) or PCIe (port 4) ・RAID zero or one option
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VT842
VadaTech 筐体 µTCA 鉄道/交通・Six mid-height AMC slots per 1U Carrier or two double width mid-height with two mid-height AMC slots ・Cascade any number of 1U Carriers for Fabric expansion and management ・Management can run as Shelf/MCMC (MicroTCA Carrier Management Controller) or MCMC ・AMC.1, AMC.2, AMC.3, AMC.4 compliant ・PCIe, SRIO, 10GbE available on ports 4 to 7 and 8 to 11 ・GbE Managed Layer Two (ports 0 and 1) ・Dual SFP+ for 10GbE
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VT849
VadaTech 筐体 µTCA ロボット 半導体製造機・Ten mid-height AMC slots per 1U Carrier or five full-height AMC slots ・Cascade any number of 1U Carriers for expansion and management ・Telco Alarm and Carrier Locator ・JTAG Switch Module (JSM) with front port access ・Telcom/GPS Clock on TCLKA, TCLKB, TCLKC and TCLKD and Fabric Clock on FCLK ・Redundant 1+1 Power supply ・Redundant Cooling Units (CU) ・Removable Power supply, Air Filter and Fan Trays ・Management can run as Shelf/MCMC (MicroTCA Carrier Management Controller) or MCMC ・AMC.2 and AMC.3 compliant ・Fabric Expansion to other 1U chassis ・10GbE available on ports 4-7 and 8-11 ・GbE Managed Layer Two (ports 0 and 1)
