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Bootable: • Can be used as a boot device CompactFlash Socket: • For Type I and II Cards IDE Support: • Connectors for both 40- and 44-Pin IDE Cabling LED Indicators: • Activity and Power Master/Slave: • Jumper Configurable Mounting Holes: • For Flush Mount or L-Bracket Installation (brackets included) Power Interface: • For 40-pin IDE Software: • No Drivers required; Compatible with Windows, Linux, QNX systems with IDE

MHeader: 10-Pin Power Header (Dual Row 0.100 inch) Bus: 16-Bit PC/104 (ISA) bus Exras: Set of 8 Nylon Board Stand-offs (with Nuts and Screws) Other Features: Standard PC/104 Mounting Holes; Spacer PCB Dimensions: 3.55" x 0.55" (part 1), 3.55" x 0.40" (part 2) Operating Temperature: -40°C to +85°C (-40°F to +185°F) Power Input: +5/+12vdc Board Dimensions: 3.550" x 3.775" Special Order Options: Conformal Coating Non-RoHS Compliant Version (PRV-0414-04)

Dimensions: Storage Temperature: 3.550" x 3.775" (PC/104) -40° to +70° C Operating Temperature: -5° to +60° C Power Consumption: 1.72 Watts (+5 VDC @ 300 mA) Power Input:: Fuses: 5VDC +/- 5% 0.5 amp, 125 v, Picofuse PCB Septum Dimensions: 3.2" L x 0.6" H x 0.6" T Bus: 16-bit PC/104 (ISA) Bus Fan Specs: RoHS Type: Ball-Bearing, Brushless; Rating: 12 CFM Fans; Fan Noise (at 1 Meter): 25 dB; Fan Speed: 6000 RPM; Life Expectancy: 50,000 hours RoHS (2002/95/CE) Compliant Replacement for PRV-0509-01

100 Watt PC104+ / PCIe104 Power Supply • MIL-STD-704F & MIL-STD-1275D Compliance • MIL-STD-461F EMI Filter / Power Conditioning • 18V to 36VDC Input Range • +3V, +5V, +12V DC Output • Extended Temperature: -40 to +85C • MIL-STD-810G Shock/Vibe/Thermal

Miniature fanless embedded Intel Atom processor system:– Small size: ~5.2” x 5.4”x 1.4” (LxWxH)– Lighweight: <1.5 lb (< 0.68 kgs)– Low power: <25W Rugged IP67 chassis with high-density MIL-performance circular connectors Modular I/O architecture: up to three slots for Mini PCIe Cards (for add-on I/O) Rugged solid-state data storage (mSATA/ removable 2.5” SATA SSD) 1000BASE-T Ethernet with TSN support Wide voltage input MIL-STD-1275/704/ DO-160 power supply Applications In-vehicle and airborne rugged embedded computing and sensor integration Civil and military SWaP-sensitive C5ISR and situational awareness upgrades Fixed-wing and rotary helicopter platforms, industrial applications Manned and autonomous vehicles (UAV, UUV, UGV, USV

Industrial NVIDIA Jetson Tegra X2i SOM + 6-core Arm v8 (Cortex-A57 + Denver 2) + 256 CUDA core Pascal GPU capable of ~1.3 TFLOPS 16-bit floating point + ECC Memory and full industrial temp • Miniature SWaP-optimized form factor: + Small size: ~2.0 x 5.2 x 5.4” (5.2 x 13.2 x 13.6 cm) + Lightweight: ~ 2.1 lb (0.95 kg) + Power: < 26W (max) CURTISSWRIGHTDS.COM The Parvus® DuraCOR® 312 is an ultra-small form factor (USFF) modular mission computer built around the high-performance, yet power efficient NVIDIA® Jetson™ TX2i “supercomputer on-a module” integrated in a miniature rugged chassis with MIL-grade high-density connectors. Combining powerful NVIDIA Pascal™/CUDA-core GPU signal processing with 64-bit Arm v8 heterogeneous multi-processing (HMP) for size, weight, power and cost (SWaP-C) sensitive mobile, airborne, ground, manned and unmanned vehicle and sensor platforms, the unit integrates a massively parallel, many-core architecture boasting one of the highest computing FLOPS-per-watt architectures on the market. Thanks to the unit’s Pascal GPU architecture (supporting Max-Q and Max-P dynamic energy profiles), larger memory bandwidth, and support for CANbus, the DuraCOR 312 can deliver up to twice the performance or power efficiency of TX1-based systems together with native vehicle bus interfaces. The unit also deliver an unparalleled modular system design, boasting multiple Mini-PCIe I/O card slots, high speed M.2 internal storage, removable SATA Flash SSD capabilities, and an aerospace-grade power supply supporting 50ms power hold-up in a fanless IP67-rated mechanical package designed for wide temperatures and harsh shock and vibration, along with ECC memory for mitigation against single event upsets at high altitudes. • Rugged IP67 chassis with micro-mini MIL-performance circular connectors • Modular I/O architecture: M.2 and Mini-PCIe I/O card slots (for storage, avionics, and vetronics I/O scalability) • Multiple rugged Flash storage options: eMMC + M.2 / removable 2.5” SATA SSD • 28 VDC MIL-1275/704/DO-160 power supply for aircraft and ground vehicles; optional 50 ms power hold-up • Qual testing for extreme MIL-STD-810G/DO-160 thermal, shock, vibration, altitude, humidity; also MIL-STD-461F/DO-160G EMI/EMC Applications • In-vehicle and airborne rugged mission computing and sensor integration • High-performance embedded computing (HPEC), general-purpose graphics processing and artificial intelligence (AI) • SWaP-sensitive C4ISR autonomous vehicles, ISR, EW and targeting systems

Size: ~39 in³ volume (approx) Weight: < 1.5 lb (< 0.68 kgs) Power: <15W • Rugged IP67 chassis with micro-mini MIL-performance circular connectors Modular I/O architecture: up to three slots for PCIe Mini-Cards (for add-on I/O) • Rugged solid-state data storage (mSATA / microSD card / removable 2.5” SATA SSD) • Wide voltage input MIL-1275/704/DO 160 power supply for aircraft and ground vehicles; optional 50ms power hold-up Extreme MIL-STD-810G/DO-160 thermal, shock, vibration, altitude, humidity; also MIL-STD-461F/DO-160G EMI/EMC Applications • Rugged embedded PC computing, sensor integration, autonomous vehicle control • Low-power, multi-core vetronics controller / processor based on Intel architecture

SWaP-optimized signal processor • 4 High-performance tuner channels + 20 MHz to 6 GHz + 40 MHz IF passband • Intel Xeon D Octal Core DSP + 410 GFLOPs with AVX2 • Xilinx Kintex-7 410T FPGA processor + User Programmable - PCIe/GTP • High bandwidth I/O options + 1 and 10 Gigabit Ethernet, USB • MIL-STD-810/MIL-STD-461 qualified Applications • Signal Intelligence • Electronic Warfare • Electronic Support Products included in the system: • MPMC-9323 Chassis Enclosure • SP-8344 Multi-Channel Tuner • VPX3-482 CHAMP-XD1 DSP • XF07-523 Xilinx Kintex-7 FPGA • PSU3-THOR Power Supply • XMC-651 Ethernet Switch (opti

3U VPX Processor Intel® Core™ Processor i7-1185GRE (Tiger Lake) •PCIe x4 Gen4 and PCIe x4 Gen3 to P1 •Dual GbE to P1 and a GbE to Front •DP/USB3.2 and SATA to P2

Fabric options include PCIe Gen3, 40/10GbE, SRIO, Cross Bar Switch (CBS) or Xilinx VU13P FPGA for complete flexibility •Front panel fabric expansion, e.g. quad Ports for PCIe Gen 3 (4x4, 2x8, or 1x16) •PLL synthesizer for generating any clock frequency disciplined to GPS/SyncE/IEEE1588 •Double module, full size per AMC.0 and MTCA.4