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• Developed in alignment with the SOSA Technical Standard as a 6U Compute Intensive Processor Plug-in-Card • 6U VPX® conduction cooled form factor with 2LM covers • Two Intel D-2700 CPUs with 12, 16 or 20 cores each at up to 2.0 GHz • Four memory channels totaling 64 GB DDR4 @2400 MT/s per CPU node (76.8 GB/s aggregate per node) • Quad 100 Gb Ethernet ports on the VPX Data Plane with RoCE V2 RDMA support • 32-lanes PCIe Gen4 Expansion Plane • Dedicated AMD® ZU6EG to ZU15EG MPSoC FPGA with embedded quad-core A53 processor and 4 GB of SDRAM memory for enhanced security or co-processing applications

Xeon D 16-core processor (870 GFLOPS @ 1.7 GHz) • Alternative Xeon D SKUs available • 128 GB DDR4 @ 2133 MT/s (34 GBps over 2 ECC channels) • Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch • PCH integrated in Xeon D SoC • Core Function FPGA (Xilinx UltraScale) and IPMI (Microsemi SmartFusion) • Air and conduction-cooled • TrustedCOTS

NXP LS1043A Arm A53 quad-core 64-bit SOC up to 1.6 GHz • 4 GB DDR4 memory • x4 PCIe Gen2 XMC • Curtiss-Wright’s U-Boot, VxWorks 7, and Linux BSPs • NXP Secure BOOT

NXP LX2160A Arm Cortex A72 16-core 64-bit Processor • Dual 64-bit memory controllers with ECC providing up to 32 GB DDR4 SDRAM • 80 GB Flash SSD (SLC) • 4-lane PCIe® XMC expansion site • Rugged conduction cooled with 2LM covers

• Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz) • Extended operating temperature Intel eTEMP SKUs • PCH integrated in Xeon D SoC • Native dual KR 10 GigE ports • 16 to 32 GB DDR4 @ 2133 mega transfers per second (34 GB/s aggregate) • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • PCIe Gen3 on 3U OpenVPX data plane with switch • Core Function FPGA and IPMI • Conduction and air-cooled • TrustedCOTS

Key Features • Dual processor Xeon D 8-core (820 GFLOPS @ 1.6 GHz total) or 12-core (1152 GFLOPS @ 1.5 GHz total) • Extended operating temperature Intel eTEMP SKUs • PCH integrated in Xeon D SoC • Four ports of 40G/10G Ethernet or DDR/ QDR/FDR10 InfiniBand on OpenVPX data plane • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane • 16 to 32 GB DDR4 @ 2133 mega transfers per second per Xeon D socket (68 GB/s aggregate) • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation • Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch • Core Function FPGA and IPMI • Air and conduction-cooled + Contact Curtiss-Wright for Air-Flow Through (AFT) or Liquid-Flow Through (LFT) options • TrustedCOTS

The CHAMP-XD3 combines the high core count and floating-point perfor mance of the Intel “Ice Lake D” processor with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form-factor. Providing an extended temperature Xeon D-1700 LCC processor with 10 dual-threaded cores, the CHAMP-XD3 brings Intel’s AVX512 floating-point capability to the rugged embedded marketplace. Processor performance is enhanced with 48 GB of high capacity DDR4-2400 in three independent memory channels, providing over 50% more memory bandwidth than prior generation modules ensuring memory accesses are not a bottleneck. The Ice Lake D processor provides new Intel Deep Learning Boost with op timized commands for AI applications which are ideal for cognitive EW and other smart sensor processing applications. Aligned with the SOSA Technical Standard, the CHAMP-XD3 supports a 40 GbE Data Plane, dual 10 GbE interfaces, and up to 16 lanes of Gen3 PCI Express® (PCIe) on the Expansion Plane, with a pinout aligned to the Payload PIC profile of the SOSA standard. The CHAMP-XD3 includes a AMD Zynq™ UltraScale+™ MPSoC field pro grammable gate array (FPGA) with additional security features, embedded quad-core Arm® A53 processor and dual-core R5 processor used for en hanced TrustedCOTS™ security, as a co-processor or for general purpose I/O. System monitoring and health is supported with IPMI (VITA 46.11) with HOST extensions as required for SOSA conformance.

The VPX3-1262 integrates Intel’s i7-13800HRE 14-core hybrid processor technology (formerly “Raptor Lake”) with Curtiss-Wright’s proven ruggedization technology to excel in harsh environments, making it ideal for architecting high performance computing and processing systems utilizing DSP, GPU and FPGA modules, and/or multiple SBC processors. With a high speed, dual-channel DDR5 memory subsystem and up to 64 GB SDRAM, the VPX3-1262 maximizes the performance of the multiple processing cores, the integrated GPU cores, and the AVX2 floating-point processing units of the processor. Up to 480 GB of high-speed NVMe SSD memory make the VPX3-1262 an ideal SBC for handling applications with demanding storage, data logging and sensor processing requirements. The VPX3-1262 includes an XMC mezzanine site to support a wide variety of expansion mezzanine daughter cards, including high performance FPGA, GPU, and storage modules. Mezzanine I/O is supported on the I/O Intensive profile variant. Multiple Ethernet ports are provided for Control and Data Plane connectivity, supporting 10GBase-KR and 1000Base-T connectivity, and supporting Time Sensitive Networking (TSN) features. The VPX3-1262 supports a 100G Ethernet Data Plane interface, with connectivity to 10G, 25G, 40G, and 50G link partners. For Expansion Plane connectivity, the VPX3-1262 supports PCI Express® (PCIe) operating at speeds up to Gen4 (16GT/s). The VPX3-1262 I/O Intensive variant supports a host of standard I/O including UART serial ports, SATA and USB ports, discrete DIO, and a DisplayPort interface supporting multiple displays with resolution up to 8K.

3U VPX™ Form Factor • Full support for IPv4 and IPv6 networks • 16 or 20 Gigabit Ethernet ports to the VPX backplane • High-performance Layer 2+ network features • Fast boot architecture with extensive Built-in Test (BIT) • IPMI to support system-wide health management • Extremely low-power operation (11W typical) • Air-cooled and conduction-cooled variants • Industry-leading technical and lifecycle management support

製品カテゴリ CPUボード フォームファクタ OpenVPX 11th Gen Intel Xeon W-11865MRE processor with Intel Advanced Vector Extensions, Intel Virtualization Technology, Intel AI Acceleration with Deep Learning Boost, Intel UHD Gfx-32 Graphics, and Intel Total Memory Encryption 8-Core (16-thread) processor at 2.6 GHz base clock, turbo to 4.7 GHz Up to 64 GB DDR4 with ECC Up to 1 TB local NVMe SSD Supports two XMC expansion mezzanines Available in air-cooled and conduction-cooled versions Supports Linux® (CentOS™ and Red Hat® Enterprise Linux [RHEL]), VxWorks®, Microsoft® Windows®, INTEGRITY, LynxOS®, and others. Series 500 Chipset Platform Controller Hub (PCH) Ethernet: Control Plane - 2 x BASE-T and 2 x SerDes; Front I/O - 1 x 1Gb ; Rear I/O - 4 x 10 Gb; 2 x BASE-T and 2 x SerDes KR/KX USB 3.1 - 1 x Front I/O & 1 x Rear I/O. 3 x USB 2.0 4 x SATA 3.0 ports Graphics ports: 2 x DisplayPort / DVI graphics ports on Rear I/O & 1 x DisplayPort++ on Front I/O Intel HD audio input and stereo output Security features: Trusted Platform Module, Intel Boot Guard, UEFI Secure Boot, SSD encryption Temperature Sensor この製品について問い合わせる