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Parvus DuraCOR 312 Rugged Miniature Modular Mission Computerwith NVIDIA Jetson TX2i

メーカー
Curtiss-Wright
製品カテゴリ
堅牢システム筐体
規格/フォームファクター
BOX
用途
防衛

Industrial NVIDIA Jetson Tegra X2i SOM

  • 6-core Arm v8 (Cortex-A57 + Denver 2)
  • 256 CUDA core Pascal GPU capable
    of ~1.3 TFLOPS 16-bit floating point
  • ECC Memory and full industrial temp
  • Miniature SWaP-optimized form factor:
  • Small size: ~2.0 x 5.2 x 5.4”
    (5.2 x 13.2 x 13.6 cm)
  • Lightweight: ~ 2.1 lb (0.95 kg)
  • Power: < 26W (max)
    CURTISSWRIGHTDS.COM
    The Parvus® DuraCOR® 312 is an ultra-small form factor (USFF)
    modular mission computer built around the high-performance,
    yet power efficient NVIDIA® Jetson™ TX2i “supercomputer
    on-a module” integrated in a miniature rugged chassis with
    MIL-grade high-density connectors. Combining powerful
    NVIDIA Pascal™/CUDA-core GPU signal processing with 64-bit
    Arm v8 heterogeneous multi-processing (HMP) for size, weight,
    power and cost (SWaP-C) sensitive mobile, airborne, ground, manned
    and unmanned vehicle and sensor platforms, the unit integrates a
    massively parallel, many-core architecture boasting one of the highest
    computing FLOPS-per-watt architectures on the market. Thanks to
    the unit’s Pascal GPU architecture (supporting Max-Q and Max-P
    dynamic energy profiles), larger memory bandwidth, and support for
    CANbus, the DuraCOR 312 can deliver up to twice the performance
    or power efficiency of TX1-based systems together with native
    vehicle bus interfaces. The unit also deliver an unparalleled modular
    system design, boasting multiple Mini-PCIe I/O card slots, high
    speed M.2 internal storage, removable SATA Flash SSD capabilities,
    and an aerospace-grade power supply supporting 50ms power
    hold-up in a fanless IP67-rated mechanical package designed for
    wide temperatures and harsh shock and vibration, along with ECC
    memory for mitigation against single event upsets at high altitudes.
  • Rugged IP67 chassis with micro-mini
    MIL-performance circular connectors
    • Modular I/O architecture: M.2 and
    Mini-PCIe I/O card slots (for storage,
    avionics, and vetronics I/O scalability)
    • Multiple rugged Flash storage options:
    eMMC + M.2 / removable 2.5” SATA SSD
    • 28 VDC MIL-1275/704/DO-160 power
    supply for aircraft and ground vehicles;
    optional 50 ms power hold-up
    • Qual testing for extreme
    MIL-STD-810G/DO-160 thermal, shock,
    vibration, altitude, humidity; also
    MIL-STD-461F/DO-160G EMI/EMC
    Applications
    • In-vehicle and airborne rugged mission
    computing and sensor integration
    • High-performance embedded computing
    (HPEC), general-purpose graphics
    processing and artificial intelligence (AI)
    • SWaP-sensitive C4ISR autonomous
    vehicles, ISR, EW and targeting systems

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