CHAMP™-XD2High Performance Multi-Core HPEC Module based onthe Intel Xeon Processor D
Key Features
• Dual processor Xeon D 8-core (820
GFLOPS @ 1.6 GHz total) or 12-core
(1152 GFLOPS @ 1.5 GHz total)
• Extended operating temperature Intel
eTEMP SKUs
• PCH integrated in Xeon D SoC
• Four ports of 40G/10G Ethernet or DDR/
QDR/FDR10 InfiniBand on OpenVPX
data plane
- Native dual KX 1 GigE or KR 10 GigE
ports on OpenVPX control plane
• 16 to 32 GB DDR4 @ 2133 mega
transfers per second per Xeon D socket
(68 GB/s aggregate)
• XMC PCIe up to Gen3, designed for up
to 25W thermal dissipation
• Dual x16 PCIe Gen3 on OpenVPX
expansion plane with switch
• Core Function FPGA and IPMI
• Air and conduction-cooled - Contact Curtiss-Wright for Air-Flow
Through (AFT) or Liquid-Flow Through
(LFT) options
• TrustedCOTS
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